EXPERIENCE MD&M WEST LIKE NEVER BEFORE...
This year, we went #BeyondWest to find a better way to bring the next-generation interconnect solution to market.
During our first exclusive speaking session, our Director of New Product Development—Braden Ta'ala—discussed the challenges impacting high-density connector miniaturization.
In our second speaking session, our VP of Engineering—Ryan Kunz—talked about the future of the camera-based device market.
If you missed it, don't worry, you can watch the technical speaking sessions by clicking on the buttons below.