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EXPERIENCE MD&M WEST LIKE NEVER BEFORE...

This year, we went #BeyondWest to find a better way to bring the next-generation interconnect solution to market.

During our first exclusive speaking session, our Director of New Product Development—Braden Ta'ala—discussed the challenges impacting high-density connector miniaturization.

In our second speaking session, our VP of Engineering—Ryan Kunz—talked about the future of the camera-based device market.

If you missed it, don't worry, you can watch the technical speaking sessions by clicking on the buttons below.

 
 

Access Tech Sessions

 
 

Going #BeyondWest