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Overcoming Engineering Challenges to Further Miniaturization

Advancements in Chip-on-Tip endoscope technology relies on the continued development of sensors, illumination and lens systems. However, to ensure endoscopes have a viable future, they must continue to shrink in diameter and cost while delivering increasingly high-quality images.To overcome the challenges associated with miniaturization—while not sacrificing quality and performance—specific engineering and manufacturing techniques need to be utilized to ensure optimal chip-on-tip performance.