Overcoming Engineering Challenges to Further Miniaturization

Advancements in Chip-on-Tip® endoscope technology rely on the continued development of sensors, illumination, and lens systems.

However, to ensure endoscopes have a viable future, they must continue to shrink in diameter and cost while delivering increasingly high-quality images.

To overcome the challenges associated with miniaturization—while not sacrificing quality and performance—specific engineering and manufacturing techniques need to be utilized to ensure optimal chip-on-tip performance.

Chip-On-Tip eBook Cover